Latest News

LayTOOLS at DAC
TexEDA Design Inc. exhibited at DAC 2011 in San Diego on booth 3119 where it demonstrated the latest enhancements now available in the LayTOOLS software.
IC Design Software Updates

LayFRAME

The LayTOOLS design flow can now run optionally under the control of a top-level design manager. This allows the user to continue with a "point solution", using individual LayTOOLS applications as he wishes, or under a "project solution" in which all the parameters and data of a given project may be united under a single framework which manages the applications for the user.The introduction of this product coincides with enhancements to both the layout editor and schematic entry application software packages.

LayED
A new command to enter wire buses has been included. The bus entity is fully supported throughout the LayTOOLS Suite (export, verification, etc.).
Three dimensional viewer in beta test - available in early 2012

LaySIM

A new product has been added to the LayTOOLS suite. To complete the design flow, a comprehensive high-end simulation tool has been linked to LayTOOLS. Fully integrated into the LayTOOLS suite and available directly from TexEDA Design Inc. is LaySIM, with the renowned SMASH kernel (either as a device-level simulator, or as a mixed-mode simulator). Interfaces to various other simulator options are also available, including Agilent's Advanced Design System (ADS) for rf designers, and Legend's MSIM device-level simulator (on the Pacific Rim). The Agilent simulator product must be purchased directly from the vendor.

LayCIR

The LayTOOLS schematic capture application (originally named SPE) has been extensively enhanced and is now available as LayCIR. The original and familiar design entry approach (issue a command then select) has been retained as an option, but the more commonly accepted approach (select then issue a command) is now also available. LaySIM is fully compatible with LayFRAME.
LayVER

LayTools verification software is under continuous enhancement and now has further updates to significantly reduce run-times and increase maximum database size. Database sizes of more than 100,000,000 extracted devices are now possible!
A Pattern Density module will allow the user to inspect a visual display of the pattern density of a given layer over a complete IC design.
Windows7™ Compatibility

Customers now use LayTools running successfully under Windows Vista™ and Windows 7™ and on 64-bit systems
License Management

LayTOOLS now runs under the Reprise License Manager (RLM license manager) which not only provides license management based on the Media Access Control address (MAC address) but provides greater flexibility than the hardware key approach previously used. The Aladdin-based license schemes used earlier are still supported.